Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application电子与封装论文
【题名】：Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer Application电子与封装论文(Comprehensive Warpage Analysis of Stacked Die MEMS Package in Accelerometer ApplicationDianZiYuFengZhuangLunWen) 【关键词】：热变形分析 MEMS封装 加速计 微电子技术 【keywords】：ReBianXingFenXi MEMSFengZhuang JiaSuJi WeiDianZiJiShu 【作者】：Xue-ren Zhang Tong Yan Tee Jing-en Luan      【来源】： 知识词典 【期刊名称】：电子与封装(DianZiYuFengZhuang) 【国际标准刊号】：1681-1070        【国内统一刊号】：32-1709/TN 【作者单位】：ST Microelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521(ST Microelectronics, 629 Lorong 4/6 Toa Payoh, Singapore 319521) 【分类号】：TN305.94      【页码】：-10-15,4      【出版年】：2006.2
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